average capacity up to 8500 wafers/hour proven in actual mass production
the system can work with carriers loading 25 to 150 wafers and it can be integrated with a wafer cleaner
double-deck trays, reducing the operation time of worker
prompt after-sales service and low maintenance cost
high speed profile sensors are applied for thickness measuring module and high-resolution cameras are used for size and stain inspection modules to improve the precision of inspection
the lateral sides in X and Y direction are inspected to minimize any missing detection of defects; micro-cracks cannot escape detection due to the accurate inspection of micro-crack module in X direction